SeongCheol_Jang

BMW sticks with Cerence to build next car voice assistant

Although it may not be clearly visible to the car users, Cerence owns a large market share of embedded automotive voice assistants, with many automotive OEMs as customers.  When it comes to voice assistants in automotive, there are two implementations – one is cloud-based and the other is embedded. While cloud-based voice assistant systems are […]

Sennheiser uses Nordic Semiconductor Bluetooth LE Audio technology

Nordic semiconductor is a well-known company in Bluetooth technology and their Bluetooth chips are widely used in many consumer devices such as voice remote, smart watch and smart speaker, etc. Nordic’s nRF5340 is an attractive Bluetooth SoC although it is missing the backend audio part so the implementation requires an external audio CODEC for a […]

Optimizing PPA with RISC-V custom extensions in TWS earbuds

In a recent TWS market study, SAR finds that the use of RISC-V cores is increasing. The RISC-V is license free core although one has sole responsibility to make the core run without any technical issues. Fabless TWS SoC companies such as mid-to-low tier IC companies may find RISC-V cores appealing due to the cost […]

GreenWaves’ GAP9 processor for hearables and smart sensors

GreenWaves’ ultra low power processor is gaining interest from the market especially in the smart portable audio devices such as TWS earbuds, etc.  GreenWaves is a fabless semiconductor company found in 2014 and their headquarter is located France.  GAP8 was GreenWaves’ first generation low power processor introduced in 2018. GAP9 is second generation processor after […]

The domestic TWS chip maker Zhongke Lanxun goes public

Zhongke Lanxun (also known as Bluetrum) recently went to public after Actions Semiconductor. Zhongke Lanxan is a Shenzhen, China based fabless company focused on developing TWS earbuds SoCs.  Bluetrum’s TWS SoC chips can be found mostly on a mid-to-low tier TWS earbuds and one of their main business is white-label market.  Bluetrum’s chips can be […]

SAR publishes its IC Platforms & Components in TWS market report

SAR recently published ‘IC Platforms & Components in TWS’ market BRIEF.  In this BRIEF, SAR does a deep dive into TWS earbuds hardware, analyzing the system architecture as well as other components inside.  Component vendors participating in the TWS earbuds are reviewed and analysed.  This BRIEF covers the IC platforms & components in TWS earbuds […]

Netflix licenses Sennheiser’s AMBEO spatial audio technology

Netflix recently announced the availability of spatial audio to all devices, but this feature does not require a surround speaker system as it is through a two channel audio configuration.  Since it is two channel audio based, the availability of spatial audio will be rather wider unlike Dolby ATMOS also available in some of the […]

MEMS speakers are replacing balanced armature speakers

MEMS speakers are about to appear in actual consumer products, especially in small form factor devices such as TWS earbuds and headphones. Efforts are also on the way to enable MEMS speakers in a larger form factor devices such as TVs, etc.  USound is one of the leading companies in the MEMS speaker area and […]

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