SAR recently published ‘IC Platforms & Components in TWS’ market BRIEF.
In this BRIEF, SAR does a deep dive into TWS earbuds hardware, analyzing the system architecture as well as other components inside.
Component vendors participating in the TWS earbuds are reviewed and analysed.
This BRIEF covers the IC platforms & components in TWS earbuds with the following key points addressed:
- Overview of the TWS earbuds system architecture
- Overview of the key components inside the TWS earbuds system
- TWS SoC market share vendor analysis (including CPU DSP cores inside the SoC)
- Vendor analysis for other components in TWS earbuds
This study is part of SAR’s TWS Audio & UI Technologies Service.