STMicroelectronics
Knowles announced its new product to compete in what is commonly known as the “bone conduction” sensor market for TWS (this should not be confused with bone conduction headphones, which transmit audio). This sensor is used to pick up the vibration of the human skull and to assist with voice pick up in noisy or windy […]
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STMicroelectronics has announced its latest headphone-focused UI chip, the LSM6DSV16BX, an integrated product that is intended to replace 2 or more components in a TWS device. This combines 3-axis wide band accelerometer and 3-axis gyroscope with an audio accelerometer, electrostatic sensor (Qvar) and processing. It enables multiple functions needed in many TWS devices: Bone conduction for voice activity detection […]
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Here is a quick round-up of some of the recent quarterly earnings reports from major semis vendors. In general, there is a mixed bag of results for different sectors, but this is largely as predicted in SAR Insight’s previous device forecasts. Let’s consider 4 major vendors Infineon, Qualcomm, STMicroelectronics and Texas Instruments. Overall, the automotive […]
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