STMicroelectronics
Airbus, a world leader in the aerospace industry, is collaborating with STMicroelectronics (ST) on power electronics Research and Development to support power electronics for future hybrid and fully electric aircraft, including urban air vehicles. This cooperation will mostly focus on exploiting the benefits of wide bandgap semiconductors, such as Silicon Carbide (SiC) and Gallium Nitride […]
Read MoreKnowles announced its new product to compete in what is commonly known as the “bone conduction” sensor market for TWS (this should not be confused with bone conduction headphones, which transmit audio). This sensor is used to pick up the vibration of the human skull and to assist with voice pick up in noisy or windy […]
Read MoreSTMicroelectronics has announced its latest headphone-focused UI chip, the LSM6DSV16BX, an integrated product that is intended to replace 2 or more components in a TWS device. This combines 3-axis wide band accelerometer and 3-axis gyroscope with an audio accelerometer, electrostatic sensor (Qvar) and processing. It enables multiple functions needed in many TWS devices: Bone conduction for voice activity detection […]
Read MoreSTMicroelectronics has achieved USB IF certification on two ICs for use in adapter (source) and device (sink) sides of a USB Power Delivery (USB PD) extended power range (EPR) power supply/charger. The 140W (28V, 5A) reference design is the first to be certified with EPR to USB PD 3.1. Whilst this innovation from STMicroelectronics is […]
Read MoreHere is a quick round-up of some of the recent quarterly earnings reports from major semis vendors. In general, there is a mixed bag of results for different sectors, but this is largely as predicted in SAR Insight’s previous device forecasts. SAR Device Forecast DATAbase. Let’s consider 4 major vendors Infineon, Qualcomm, STMicroelectronics and Texas […]
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