ST Strengthens position in the TWS sensor market

By Joe Murray / March 28, 2023
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STMicroelectronics has announced its latest headphone-focused UI chip, the LSM6DSV16BX, an integrated product that is intended to replace 2 or more components in a TWS device. This combines 3-axis wide band accelerometer and 3-axis gyroscope with an audio accelerometer, electrostatic sensor (Qvar) and processing. It enables multiple functions needed in many TWS devices: Bone conduction for voice activity detection […]

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